Electronic component

ABSTRACT

An electronic component includes a multilayer capacitor and an interposer. First and second internal electrodes of the multilayer capacitor are such that 0.95≤{(Wm 1 +Wm 2 )/Wa}/{(Lm 1 +Lm 2 )/La}≤4.93, in which Lm 2  is a distance between a first internal electrode and a fourth surface of a capacitor body, Lm 1  is a distance between a second internal electrode and a third surface of the capacitor body opposite the fourth surface in a first direction, Wm 1  is a distance between the first or second internal electrode and a second surface of the capacitor body, Wm 2  is a distance between the first or second internal electrode and a first surface of the capacitor body opposite the second surface in a third direction, La is a length in the first direction of a region of overlap of the first and second internal electrodes, and Wa is a length in the third direction of the region of overlap.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application claims the benefit under 35 USC 119(a) of Korean PatentApplication No. 10-2019-0162559 filed on Dec. 9, 2019 in the KoreanIntellectual Property Office, the entire disclosure of which isincorporated herein by reference for all purposes.

BACKGROUND 1. Field

The present disclosure relates to an electronic component.

2. Description of Related Art

Multilayer capacitors are widely used as components of variouselectronic devices due to the small size, high capacity, and ease ofmounting thereof.

Multilayer capacitors (MLCCs) have a structure in which internalelectrodes having different polarities are alternately disposed betweena plurality of dielectric layers, to have the dielectric layersinterposed therebetween.

In this case, since the dielectric layers have piezoelectric propertiesthrough using a ferroelectric material, a piezoelectric phenomenonoccurs between internal electrodes when a direct current or alternatingcurrent is applied to the multilayer capacitor, thereby expanding andcontracting the volume of a capacitor body depending on frequency andgenerating periodic vibrations.

Such vibrations may be transmitted to a substrate through a solderconnecting an external electrode of the multilayer capacitor to thesubstrate when mounting thereof on the substrate is performed, and thusthe entire substrate may become an acoustic reflection surface thatgenerates vibration sound that may be experienced as noise.

The vibration sound may correspond to an audible frequency causinglistener discomfort, and thus, the vibration sound causing listenerdiscomfort is known as acoustic noise.

SUMMARY

This Summary is provided to introduce a selection of concepts insimplified form that are further described below in the DetailedDescription. This Summary is not intended to identify key features oressential features of the claimed subject matter, nor is it intended tobe used as an aid in determining the scope of the claimed subjectmatter.

An aspect of the present disclosure is to provide an electroniccomponent capable of securing a predetermined level or more of moistureresistance and reducing acoustic noise.

According to an aspect of the present disclosure, an electroniccomponent includes a multilayer capacitor including a capacitor bodyhaving first and second surfaces opposing each other in a thirddirection, third and fourth surfaces connected to the first and secondsurfaces and opposing each other in a first direction, and fifth andsixth surfaces connected to the first and second surfaces, connected tothe third and fourth surfaces, and opposing each other in a seconddirection. The multilayer capacitor includes first and second externalelectrodes respectively disposed on the third and fourth surfaces of thecapacitor body. An interposer is disposed on a side of the first surfaceof the multilayer capacitor. The capacitor body includes a plurality ofdielectric layers, and pluralities of first internal electrodes andsecond internal electrodes alternately stacked in the second directionwith the dielectric layers interposed therebetween. The plurality offirst and second internal electrodes are exposed through the third andfourth surfaces of the capacitor body, respectively. When a distancebetween the first internal electrodes and the fourth surface of thecapacitor body is defined as Lm2, a distance between the second internalelectrodes and the third surface of the capacitor body is defined asLm1, a distance between the first or second internal electrodes and thesecond surface of the capacitor body is defined as Wm1, a distancebetween the first or second internal electrodes and the first surface ofthe capacitor body is defined as Wm2, a length in the first direction ofa region of overlap of the first and second internal electrodes isdefined as La, and a length in the third direction of the region ofoverlap of the first and second internal electrodes is defined as Wa,0.95≤{(Wm1+Wm2)/Wa}/{(Lm1+Lm2)/La}≤4.93.

The interposer may include an interposer body and first and secondexternal terminals disposed on opposing ends of the interposer body inthe first direction. The first external terminal may include a firstbonding portion disposed on the interposer body to be connected to thefirst external electrode, a first mounting portion disposed on theinterposer body opposite to the first bonding portion in the thirddirection, and a first connection portion disposed on the interposerbody to connect the first bonding portion and the first mountingportion. The second external terminal may include a second bondingportion disposed on the interposer body to be connected to the secondexternal electrode, a second mounting portion disposed on the interposerbody opposite to the second bonding portion in the third direction, anda second connection portion disposed on the interposer body to connectthe second bonding portion and the second mounting portion.

The first and second external electrodes and the first and secondbonding portions may be provided with a conductive adhesive disposedtherebetween, respectively.

The conductive adhesive may be a high melting point solder.

The first and second external terminals may have a ‘[’-shaped crosssection and a ‘]’-shaped cross section, respectively.

A length of the interposer in the first direction may be less than alength of the multilayer capacitor in the first direction, and a lengthof the interposer in the second direction may be less than a length ofthe multilayer capacitor in the second direction.

The interposer body may be formed of alumina.

The first and second external electrodes may include first and secondconnection portions disposed on the third and fourth surfaces of thecapacitor body, respectively, and first and second band portionsrespectively extending from the first and second connection portions torespective portions of the first surface of the capacitor body.

The electronic component may further include a plating layer disposed onsurfaces of the first and second external electrodes.

The electronic component may further include a plating layer disposed onsurfaces of the first and second external terminals of the interposer.

The first and second internal electrodes may be spaced evenly apart fromthe first and second surfaces.

In accordance with another aspect of the present disclosure, anelectronic component includes a body having a plurality of firstinternal electrodes and a plurality of second internal electrodes thatare alternately stacked to overlap with each other in a seconddirection, the first and second internal electrodes having dielectriclayers interposed therebetween. The internal electrodes are such that0.95≤{(Wm1+Wm2)/Wa}/{(Lm1+Lm2)/La}≤4.93, in which Lm1 and Lm2 aredistances between a region of overlap of the first and second internalelectrodes and respective side surfaces of the body opposing each otherin a first direction orthogonal to the second direction, La is a lengthof the region of overlap of the first and second internal electrodes inthe first direction, Wm1 and Wm2 are distances between a region ofoverlap of the first and second internal electrodes and respective sidesurfaces of the body opposing each other in a third direction orthogonalto the first and second directions, and Wa is a length of the region ofoverlap of the first and second internal electrodes in the thirddirection.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects, features, and advantages of the presentdisclosure will be more clearly understood from the following detaileddescription, taken in conjunction with the accompanying drawings, inwhich:

FIG. 1 is a partially cutaway perspective view illustrating a multilayercapacitor applied to an electronic component according to an embodimentof the present disclosure;

FIGS. 2A and 2B are plan views illustrating first and second internalelectrodes of the multilayer capacitor of FIG. 1, respectively;

FIG. 3 is a perspective view of an electronic component according to anembodiment of the present disclosure;

FIG. 4 is an exploded perspective view of FIG. 3; and

FIG. 5 is a cross-sectional view taken along line I-I′ of FIG. 3.

DETAILED DESCRIPTION

The following detailed description is provided to assist the reader ingaining a comprehensive understanding of the methods, apparatuses,and/or systems described herein. However, various changes,modifications, and equivalents of the methods, apparatuses, and/orsystems described herein will be apparent to one of ordinary skill inthe art. The sequences of operations described herein are merelyexamples, and the disclosure is not limited to those set forth herein,as the sequences may be changed as will be apparent to one of ordinaryskill in the art, with the exception of operations necessarily occurringin a certain order. Also, descriptions of functions and constructionsthat would be well known to one of ordinary skill in the art may beomitted for increased clarity and conciseness.

The features described herein may be embodied in different forms, andare not to be construed as being limited to the examples describedherein. Rather, the examples described herein have been provided so thatthis disclosure will be thorough and complete, and will fully convey thescope of the disclosure to one of ordinary skill in the art.

Herein, it is noted that use of the term “may” with respect to anexample or embodiment, e.g., as to what an example or embodiment mayinclude or implement, means that at least one example or embodimentexists in which such a feature is included or implemented while allexamples and embodiments are not limited thereto.

Throughout the specification, when an element, such as a layer, region,or substrate, is described as being “on,” “connected to,” or “coupledto” another element, it may be directly “on,” “connected to,” or“coupled to” the other element, or there may be one or more otherelements intervening therebetween. In contrast, when an element isdescribed as being “directly on,” “directly connected to,” or “directlycoupled to” another element, there can be no other elements interveningtherebetween.

As used herein, the term “and/or” includes any one and any combinationof any two or more of the associated listed items.

Although terms such as “first,” “second,” and “third” may be used hereinto describe various members, components, regions, layers, or sections,these members, components, regions, layers, or sections are not to belimited by these terms. Rather, these terms are only used to distinguishone member, component, region, layer, or section from another member,component, region, layer, or section. Thus, a first member, component,region, layer, or section referred to in examples described herein mayalso be referred to as a second member, component, region, layer, orsection without departing from the teachings of the examples.

Spatially relative terms such as “above,” “upper,” “below,” and “lower”may be used herein for ease of description to describe one element'spositional relationship to another element in the orientationillustrated in the figures. Such spatially relative terms are intendedto encompass different orientations of the device in use or operation inaddition to the orientation depicted in the figures. For example, if thedevice in the figures is turned over, an element described as being“above” or “upper” relative to another element will then be “below” or“lower” relative to the other element. Thus, the term “above”encompasses both the above and below orientations depending on thespatial orientation of the device. The device may also be oriented inother ways (for example, rotated 90 degrees or at other orientations),and the spatially relative terms used herein are to be interpretedaccordingly.

The terminology used herein is for describing various examples only, andis not to be used to limit the disclosure. The articles “a,” “an,” and“the” are intended to include the plural forms as well, unless thecontext clearly indicates otherwise. The terms “comprises,” “includes,”and “has” specify the presence of stated features, numbers, operations,members, elements, and/or combinations thereof, but do not preclude thepresence or addition of one or more other features, numbers, operations,members, elements, and/or combinations thereof.

Due to manufacturing techniques and/or tolerances, variations of theshapes illustrated in the drawings may occur. Thus, the examplesdescribed herein are not limited to the specific shapes illustrated inthe drawings, but include changes in shape that occur duringmanufacturing.

The features of the examples described herein may be combined in variousways as will be apparent after an understanding of the disclosure ofthis application. Further, although the examples described herein have avariety of configurations, other configurations are possible as will beapparent after an understanding of the disclosure of this application.

The drawings may not be to scale, and the relative size, proportions,and depiction of elements in the drawings may be exaggerated forclarity, illustration, and convenience.

Subsequently, examples are described in further detail with reference tothe accompanying drawings.

When the direction is defined to clearly describe the embodiments of thepresent disclosure, X, Y, and Z illustrated in the drawings respectivelyindicate the length direction, the width direction, and the thicknessdirection of the multilayer capacitor and the interposer.

In the embodiment, the Y direction may be used in the same concept asthe stacking direction in which dielectric layers 111 are stacked orlaminated.

FIG. 1 is a partially cutaway perspective view of a multilayer capacitorapplied to an electronic component according to an embodiment, and FIGS.2A and 2B are plan views illustrating first and second internalelectrodes of the multilayer capacitor of FIG. 1, respectively.

First, the structure of a multilayer capacitor 100 applied to anelectronic component according to an embodiment will be described withreference to FIGS. 1, 2A, and 2B.

The multilayer capacitor 100 according to this embodiment includes acapacitor body 110 and first and second external electrodes 131 and 132formed on opposing ends of the capacitor body 110 in the X direction,respectively.

The capacitor body 110 is obtained by stacking a plurality of dielectriclayers 111 in the Y direction, being followed by firing, and thedielectric layers 111 of the capacitor body 110, adjacent to each other,may be integrated with each other to such an extent that the boundarytherebetween is difficult to confirm without using a scanning electronmicroscope (SEM).

The capacitor body 110 includes a plurality of dielectric layers 111,and a plurality of first and second internal electrodes 121 and 122having different polarities alternately disposed in the Y direction withthe plurality of dielectric layer 111 interposed therebetween.

The capacitor body 110 is not particularly limited in shape, but mayhave a hexahedral shape, and may include first and second surfaces 1 and2 opposing each other in the Z direction, third and fourth surfaces 3and 4 connected to the first and second surfaces 1 and 2 and opposingeach other in the X direction, and fifth and sixth surfaces 5 and 6connected to the first and second surfaces 1 and 2, connected to thethird and fourth surfaces 3 and 4, and opposing each other in the Ydirection.

The capacitor body 110 may include an active region as a portioncontributing to the capacitance formation of the capacitor, and a coverregion provided on both sides of the capacitor body 110 in the Ydirection and upper and lower portions of the active region in the Zdirection, as a margin portion.

The cover region may have the same material and configuration as thedielectric layer(s) 111 except that the cover region does not includeany internal electrode.

The cover region may be formed by stacking a single dielectric layer ortwo or more dielectric layers on both sides of the active region in theY direction, and may basically serve to prevent damage to the first andsecond internal electrodes 121 and 122 due to physical or chemicalstress.

The dielectric layer(s) 111 may include ceramic powder, for example,BaTiO₃-based ceramic powder or the like.

The BaTiO₃-based ceramic powder may be (Ba_(1-x)Ca_(x)) TiO₃,Ba(Ti_(1-y)Ca_(y))O₃, (Ba_(1-x)Ca_(x)) (Ti_(1-y)Zr_(y))O₃ orBa(Ti_(1-y)Zr_(y))O₃ in which Ca or Zr is partially solid dissolved inBaTiO₃, but is not limited thereto.

Along with the ceramic powder, a ceramic additive, an organic solvent, aplasticizer, a binder and a dispersant may be further added to thedielectric layer 111.

The ceramic additive may include, for example, transition metal oxide ortransition metal carbide, rare earth element, magnesium (Mg) or aluminum(Al).

The first and second internal electrodes 121 and 122 are electrodes towhich voltages having different polarities are applied, and may beformed on the dielectric layer 111 to be stacked in the Y direction, andmay be alternately disposed to face or overlap each other (in the Ydirection) with one dielectric layer 111 interposed therebetween withinthe capacitor body 110.

The first and second internal electrodes 121 and 122 may be electricallyinsulated from each other by the dielectric layer(s) 111 disposedtherebetween.

On end of each of the first internal electrodes 121 may be exposedthrough the third surface 3 of the capacitor body 110, and one end ofeach of the second internal electrodes 122 may be exposed through thefourth surface 4 of the capacitor body 110.

End portions of the first and second internal electrodes 121 and 122alternately exposed through the third and fourth surfaces 3 and 4 of thecapacitor body 110 may be electrically connected to the first and secondexternal electrodes 131 and 132 disposed on opposite ends of thecapacitor body 110 in the X direction, to be described later.

In this configuration, when a predetermined voltage is applied to thefirst and second external electrodes 131 and 132, charges areaccumulated between the first and second internal electrodes 121 and122.

In this case, the capacitance of the multilayer capacitor 100 isproportional to the overlapped areas of the first and second internalelectrodes 121 and 122 overlapping each other in the Y direction in theactive region.

The material for forming the first and second internal electrodes 121and 122 is not particularly limited. For example, the first and secondinternal electrodes 121 and 122 may be formed using a precious metalmaterial such as platinum (Pt), palladium (Pd), and a palladium-silver(Pd—Ag) alloy and a conductive paste formed of at least one of nickel(Ni) and copper (Cu).

As the printing method of the conductive paste, a screen printing methodor a gravure printing method may be used, but an embodiment thereof isnot limited thereto.

The first and second external electrodes 131 and 132 are provided withvoltages having different polarities, are disposed on opposite ends ofthe capacitor body 110 in the X direction, and may be electricallyconnected to exposed-one ends of the first and second internalelectrodes 121 and 122, respectively.

The first external electrode 131 may include a first connection portion131 a and a first band portion 131 b.

The first connection portion 131 a is disposed on the third surface 3 ofthe capacitor body 110, and contacts one end of each of the firstinternal electrode(s) 121 exposed to the outside thereof through thethird surface 3 of the capacitor body 110 to serve to electricallyconnect the first internal electrode(s) 121 and the first externalelectrode 131.

The first band portion 131 b is a portion extending from the firstconnection portion 131 a to a portion of the first surface 1 of thecapacitor body 110 to be connected to a first external terminal of aninterposer described later.

In this case, the first band portion 131 b may further extend from thefirst connection portion 131 a to portions of the second, fifth, andsixth surfaces 2, 5, 6 of the capacitor body 110 to improve fixingstrength.

The second external electrode 132 may include a second connectionportion 132 a and a second band portion 132 b.

The second connection portion 132 a is disposed on the fourth surface 4of the capacitor body 110 and contacts one end of each of the secondinternal electrode(s) 122 exposed to the outside thereof through thefourth surface 4 of the capacitor body 110 to serve to electricallyconnect the second internal electrode (s) 122 and the second externalelectrode 132 to each other.

The second band portion 132 b extends from the second connection portion132 a to a portion of the first surface 1 of the capacitor body 110 tobe connected to a second external terminal of the interposer, which willbe described later.

In this case, the second band portion 132 b may further extend from thefirst connection portion 132 a to portions of the second, fifth andsixth surfaces 2, 5 and 6 of the capacitor body 110 to improve thefixing strength.

The first and second external electrodes 131 and 132 may further includea plating layer.

The plating layer may include first and second nickel (Ni) platinglayers formed on surfaces of the first and second external electrodes131 and 132, and first and second tin (Sn) plating layers covering thefirst and second nickel plating layers, respectively.

FIG. 3 is a perspective view of an electronic component according to anembodiment, FIG. 4 is an exploded perspective view of FIG. 3, and FIG. 5is a cross-sectional view taken along line I-I′ of FIG. 3.

Referring to FIGS. 3 to 5, an electronic component 101 according to thisembodiment includes a multilayer capacitor 100 and an interposer 200disposed on the first surface (1) side of the multilayer capacitor 100.

The interposer 200 includes an interposer body 210 and first and secondexternal terminals 220 and 230 formed on opposite ends of the interposerbody 210 in the X direction.

In this case, the length of the interposer 200 may be smaller than thelength of the multilayer capacitor 100, in the X direction, and thelength of the interposer 200 may be smaller than the length of themultilayer capacitor 100 in the Y direction.

When the lengths of the interposer 200 are smaller than those of themultilayer capacitor 100 in the X and Y directions, a step is generatedbetween side surfaces of the multilayer capacitor 100 and the interposer200, and the step serves as a solder pocket configured to be filled withsolder to reduce a solder height when performing mounting on thesubstrate, thereby reducing the height of the solder and resulting in anacoustic noise reduction effect.

The interposer body 210 may be formed of a ceramic material, and indetail, may be formed of alumina (Al₂O₃).

The first and second external terminals 220 and 230 are provided withvoltages having different polarities, and are electrically connected tothe first and second band portions 131 b and 132 b of the first andsecond external electrodes 131 and 132, respectively.

The first external terminal 220 includes a first bonding portion 221, afirst mounting portion 222, and a first connection portion 223.

The first bonding portion 221 is a portion formed on the upper surfaceof the interposer body 210, has one end exposed through one surface ofthe interposer body 210 in the X direction, and is connected to thefirst band portion 131 b of the first external electrode 131.

The first mounting portion 222 is a portion formed on the lower surfaceof the interposer body 210 to face or oppose the first bonding portion221 in the Z direction, and may serve as a terminal when performingmounting on the substrate.

The first connection portion 223 is formed on one end surface of theinterposer body 210 in the X direction and serves to connect the end ofthe first bonding portion 221 and the end of the first mounting portion222.

Accordingly, the first external terminal 220 may be formed to have a[-shaped X-Z cross section.

A first conductive bonding agent 310 may be disposed between the firstbonding portion 221 and the first band portion 131 b to mechanically andelectrically bond the first bonding portion 221 and the first bandportion 131 b to each other.

The first conductive adhesive 310 may be formed of a high melting pointsolder or the like.

The high melting point solder may include, for example, at least one ormore of antimony (Sb), cadmium (Cd), lead (Pb), zinc (Zn), aluminum(Al), and copper (Cu).

The second external terminal 230 includes a second bonding portion 231,a second mounting portion 232, and a second connection portion 233.

The second bonding portion 231 is a portion formed on the upper surfaceof the interposer body 210, has one end exposed through the othersurface of the interposer body 210 in the X direction, and is connectedto the second band portion 132 b of the second external electrode 132.

The second mounting portion 232 is a portion disposed on the lowersurface of the interposer body 210 to face or oppose the second bondingportion 231 in the Z direction, and may serve as a terminal whenperforming mounting on a substrate.

The second connection portion 233 is formed on the other end surface ofthe interposer body 210 in the X direction and serves to connect the endof the second bonding portion 231 and the end of the second mountingportion 232.

Accordingly, the second external terminal 230 may be formed to havea]-shaped X-Z cross section.

A second conductive bonding agent 320 is disposed between the secondbonding portion 231 and the second band portion 132 b to mechanicallyand electrically bond the second bonding portion 231 and the second bandportion 132 b to each other.

The second conductive adhesive 320 may be formed of a high melting pointsolder or the like.

If necessary, a plating layer may be further formed on the surfaces ofthe first and second external terminals 220 and 230.

The plating layer may include an inner nickel (Ni) plating layer and atin (Sn) plating layer covering the nickel plating layer.

When voltages having different polarities are applied to the first andsecond external electrodes 131 and 132 formed on the electroniccomponent 101 while the electronic component 101 is mounted on asubstrate, an inverse piezoelectric effect of the dielectric layer 111causes the capacitor body 110 to expand and contract in the Z direction.

Accordingly, both ends of the first and second external electrodes 131and 132 contract and expand in the opposite direction to expansion andcontraction of the capacitor body 110 in the Z direction by the Poissoneffect. The contraction and expansion cause vibrations.

The vibrations are transmitted to the substrate through the first andsecond external electrodes 131 and 132 and the first and second externalterminals 220 and 230, whereby sound is radiated from the substrate tobecome acoustic noise.

The interposer 200 according to an embodiment is attached to the firstsurface 1 side of the multilayer capacitor 100 facing the mountingdirection to absorb vibrations of the multilayer capacitor 100 andprevent the vibration from being transmitted to the substrate.

In detail, since the multilayer capacitor 100 according to an embodimentis bonded to the interposer 200 while the internal electrodes arestacked to be perpendicular to the mounting surface of the interposer200, the transmission of vibration to the substrate from the multilayercapacitor 100 is hindered and acoustic noise is thus reduced.

In the case of piezoelectric vibrations of the multilayer capacitor 100,phases of the Z-direction displacement and the Y and X-directiondisplacement are opposite to each other, and the ratio of theX-direction strain and the Z-direction strain are constant by Poisson'sRatio.

Therefore, since the ratio of the displacement in the Z direction andthe displacement in the Y and X directions is constant, the Y directiondisplacement and the X direction displacement may be adjusted within apredetermined range by changing the internal structure and the externalsize of the multilayer capacitor 100.

As in this embodiment, in the case of the electronic component 101 inwhich the interposer 200 is disposed on the first surface 1 side of themultilayer capacitor 100 and the internal electrodes are disposedperpendicular to the interposer 200, the Z-direction amplitude and theX-direction amplitude of the multilayer capacitor 100 have relativelylow contribution to vibration transmission to the substrate since thereis no fixed surface.

On the other hand, since the Y-direction amplitude of the multilayercapacitor 100 transmits vibration directly to the interposer 200, thecontribution to vibration transmission to the substrate is relativelyhigh.

Therefore, in the case in which the displacement in the Y direction isreduced and the displacement in the X direction is increased by changingthe internal structure and the external size of the multilayer capacitor100, and in the case of the multilayer capacitor 100 having the samecharacteristics, an electronic component optimized for reducing acousticnoise may be manufactured.

In this embodiment, to reduce the size of the electronic component 101,the multilayer capacitor 100 is designed to have a size optimized forreducing the Z-direction length of the multilayer capacitor 100 andreducing acoustic noise.

To this end, when a distance between the first internal electrode 121and the fourth surface 4 of the capacitor body 110 is defined as Lm2, adistance between the second internal electrode 122 and the third surface3 of the capacitor body 110 is defined as Lm1, a distance between thefirst or second internal electrode 121 or 122 and the second surface 2of the capacitor body 110 is defined as Wm1, a distance between thefirst or second internal electrode 121 or 122 and the first surface 1 ofthe capacitor body 110 is defined as Wm2, a length of a portion in the Xdirection, in which the first and second internal electrodes 121 and 122overlap each other, is defined as La, and a length of the portion inwhich the first and second internal electrodes 121 and 122 overlap, thelength being in the Z direction connecting the first and second surfaces1 and 2 of the capacitor body 110, is defined as Wa,0.95≤{(Wm1+Wm2)/Wa}/{(Lm1+Lm2)/La}≤4.93.

A method of reducing the displacement of the multilayer capacitor 110 inthe Y direction is to increase the Wm1 or Wm2 to increase a peripheralmargin without generating the piezoelectric vibration, compared to theactive region that causes the piezoelectric vibration, therebysuppressing the vibrations.

In this case, the displacement suppressed in the Y direction may beswitched to the X direction displacement having the same phase thereas,and Lm1 or Lm2 may be reduced to facilitate this switching.

For example, the larger the ratio (R) of (Wm1+Wm2)/Wa to (Lm1+Lm2)/Lais, the more the displacement in the Y direction is suppressed, so thatthe acoustic noise reduction effect of the entire electronic product 101may be improved. On the other hand, if the R value deviates from apredetermined value, a problem may occur in the moisture resistancereliability of the multilayer capacitor 100.

When the numerical limitation 0.95≤{(Wm1+Wm2)/Wa}/{(Lm1+Lm2)/La}≤4.93 issatisfied, acoustic noise may be reduced while securing a predeterminedlevel or more of moisture resistance reliability.

Experimental Example

Multilayer capacitors of 2.0×1.2 mm size, 22 uF, and 25V class weremanufactured to have various designs as illustrated in Table 1 below,and electronic components were manufactured by bonding 1.7×1.2×0.52 mmsize ceramic interposers with a high melting point solder.

Moreover, acoustic noise of the produced electronic component wasmeasured and moisture resistance evaluation was performed.

The moisture resistance evaluation determined that NG was a case inwhich IR decreased by 1 order (10¹)Ω or more after applying 25V at 85°C. and 85% relative humidity (RH) for 24 hours.

Table 1 below illustrates acoustic noise and moisture resistanceevaluation results according to R values. In this case, R indicates{(Wm1+Wm2)/Wa}/{(Lm1+Lm2)/La}.

Active Defect in Region L Lm La (Lm1 + W Wm (Wm1 + Acoustic MoistureResistance # Area (mm²) (mm) (mm) (mm) Lm2)/LA (mm) (mm) Wa Wm2)/Wa RNoise (dB) Evaluation (EA)  1 1.55 2.0 0.240 1.520 0.316 1.2 0.090 1.0200.176 0.56 37.4 23/40  2 1.55 2.0 0.220 1.560 0.282 1.2 0.103 0.9940.207 0.73 36.8  5/40  3 1.55 2.0 0.200 1.600 0.250 1.2 0.115 0.9700.237 0.95 36.2  0/40  4 1.55 2.0 0.180 1.640 0.220 1.2 0.127 0.9460.268 1.22 34.9  0/40  5 1.55 2.0 0.160 1.680 0.190 1.2 0.140 0.9200.304 1.60 34.0  0/40  6 1.55 2.0 0.140 1.720 0.163 1.2 0.150 0.9000.333 2.05 32.6  0/40  7 1.55 2.0 0.120 1.760 0.136 1.2 0.160 0.8800.364 2.67 31.8  0/40  8 1.55 2.0 0.100 1.800 0.111 1.2 0.170 0.8600.395 3.56 30.1  0/40  9 1.55 2.0 0.080 1.840 0.087 1.2 0.180 0.8400.429 4.93 29.5  0/40 10 1.55 2.0 0.060 1.880 0.064 1.2 0.187 0.8260.453 7.09 28.2 14/40 11 1.55 2.0 0.040 1.920 0.042 1.2 0.197 0.8060.489 11.73 27.7 40/40

Referring to Table 1, it can be seen that the acoustic noise decreasesas the R value increases.

In addition, in the case of Sample 1 and Sample 2 in which R is lessthan 0.95, it can be confirmed that a defect occurs in the moistureresistance evaluation.

In addition, in the case of Sample 10 and Sample 11 in which R isgreater than 4.93, acoustic noise showed a lowest value of less than 30dB, but it can be seen that a failure occurred in the moistureresistance evaluation.

Therefore, in order for electronic components to reduce acoustic noiseto less than 40 dB and to ensure a certain level of moisture resistancereliability, an appropriate range of {(Wm1+Wm2)/Wa}/{(Lm1+Lm2)/La}satisfies 0.95 to 4.93.

As set forth above, according to an embodiment, a vertical stacked typemultilayer capacitor and an interposer are included, and the ratio ofthe margin in the vertical to the margin of the capacitor body in thelength direction is limited, thereby increasing the moisture resistancereliability of the multilayer capacitor by a predetermined level or moreand reducing acoustic noise.

While this disclosure includes specific examples, it will be apparent toone of ordinary skill in the art that various changes in form anddetails may be made in these examples without departing from the spiritand scope of the claims and their equivalents. The examples describedherein are to be considered in a descriptive sense only, and not forpurposes of limitation. Descriptions of features or aspects in eachexample are to be considered as being applicable to similar features oraspects in other examples. Suitable results may be achieved if thedescribed techniques are performed to have a different order, and/or ifcomponents in a described system, architecture, device, or circuit arecombined in a different manner, and/or replaced or supplemented by othercomponents or their equivalents. Therefore, the scope of the disclosureis defined not by the detailed description, but by the claims and theirequivalents, and all variations within the scope of the claims and theirequivalents are to be construed as being included in the disclosure.

What is claimed is:
 1. An electronic component comprising: a multilayercapacitor including a capacitor body having first and second surfacesopposing each other in a third direction, third and fourth surfacesconnected to the first and second surfaces and opposing each other in afirst direction, and fifth and sixth surfaces connected to the first andsecond surfaces, connected to the third and fourth surfaces, andopposing each other in a second direction, the multilayer capacitorincluding first and second external electrodes respectively disposed onthe third and fourth surfaces; and an interposer disposed on a side ofthe first surface of the multilayer capacitor, wherein the capacitorbody includes a plurality of dielectric layers, and pluralities of firstinternal electrodes and second internal electrodes alternately stackedin the second direction with the dielectric layers interposedtherebetween, the plurality of first and second internal electrodes areexposed through the third and fourth surfaces of the capacitor body,respectively, and wherein 0.95≤{(Wm1+Wm2)/Wa}/{(Lm1+Lm2)/La}≤4.93, inwhich Lm2 is a distance between the first internal electrodes and thefourth surface of the capacitor body, Lm1 is a distance between thesecond internal electrodes and the third surface of the capacitor body,Wm1 is a distance between the first or second internal electrodes andthe second surface of the capacitor body, Wm2 is a distance between thefirst or second internal electrodes and the first surface of thecapacitor body, La is a length in the first direction of a region ofoverlap of the pluralities of first and second internal electrodes, andWa is a length in the third direction of the region of overlap of thepluralities of first and second internal electrodes.
 2. The electroniccomponent of claim 1, wherein the interposer comprises an interposerbody and first and second external terminals disposed on opposing endsof the interposer body in the first direction, wherein the firstexternal terminal comprises a first bonding portion disposed on theinterposer body to be connected to the first external electrode, a firstmounting portion disposed on the interposer body opposite to the firstbonding portion in the third direction, and a first connection portiondisposed on the interposer body to connect the first bonding portion andthe first mounting portion, and the second external terminal comprises asecond bonding portion disposed on the interposer body to be connectedto the second external electrode, a second mounting portion disposed onthe interposer body opposite to the second bonding portion in the thirddirection, and a second connection portion disposed on the interposerbody to connect the second bonding portion and the second mountingportion.
 3. The electronic component of claim 2, wherein the first andsecond external electrodes and the first and second bonding portions areprovided with a conductive adhesive disposed therebetween, respectively.4. The electronic component of claim 3, wherein the conductive adhesiveis a high melting point solder.
 5. The electronic component of claim 2,wherein the first and second external terminals have a ‘[’-shaped crosssection and a ‘]’-shaped cross section, respectively.
 6. The electroniccomponent of claim 1, wherein a length of the interposer in the firstdirection is less than a length of the multilayer capacitor in the firstdirection, and a length of the interposer in the second direction isless than a length of the multilayer capacitor in the second direction.7. The electronic component of claim 2, wherein the interposer body isformed of alumina.
 8. The electronic component of claim 1, wherein thefirst and second external electrodes comprise first and secondconnection portions disposed on the third and fourth surfaces of thecapacitor body, respectively, and first and second band portionsrespectively extending from the first and second connection portions torespective portions of the first surface of the capacitor body.
 9. Theelectronic component of claim 1, further comprising a plating layerdisposed on surfaces of the first and second external electrodes. 10.The electronic component of claim 2, further comprising a plating layerdisposed on surfaces of the first and second external terminals of theinterposer.
 11. The electronic component of claim 1, wherein the firstand second internal electrodes are spaced evenly apart from the firstand second surfaces.
 12. An electronic component comprising: a bodycomprising a plurality of first internal electrodes and a plurality ofsecond internal electrodes that are alternately stacked to overlap witheach other in a second direction, the first and second internalelectrodes having dielectric layers interposed therebetween, wherein0.95≤{(Wm1+Wm2)/Wa}/{(Lm1+Lm2)/La}≤4.93, in which Lm1 and Lm2 aredistances between a region of overlap of the first and second internalelectrodes and respective side surfaces of the body opposing each otherin a first direction orthogonal to the second direction, La is a lengthof the region of overlap of the first and second internal electrodes inthe first direction, Wm1 and Wm2 are distances between a region ofoverlap of the first and second internal electrodes and respective sidesurfaces of the body opposing each other in a third direction orthogonalto the first and second directions, and Wa is a length of the region ofoverlap of the first and second internal electrodes in the thirddirection.
 13. The electronic component of claim 12, wherein the regionof overlap of the first and second internal electrodes is spaced evenlyapart from the side surfaces of the body opposing each other in thethird direction.
 14. The electronic component of claim 12, furthercomprising: first and second external electrodes respectively disposedon the respective side surfaces of the body opposing each other in thefirst direction, wherein the first and second external electrodesrespectively contact each of the first internal electrodes and each ofthe second internal electrodes on the respective side surfaces of thebody opposing each other in the first direction.
 15. The electroniccomponent of claim 12, further comprising: first and second externalelectrodes disposed on one side surface of the side surfaces of the bodyopposing each other in the third direction; and an interposer havingfirst and second external terminals disposed on opposing ends of theinterposer body, wherein the first and second external terminals of theinterposer are bonded to the first and second external electrodes,respectively.
 16. The electronic component of claim 15, wherein a lengthof the interposer in the first direction is less than a length of thebody in the first direction, and a length of the interposer in thesecond direction is less than a length of the body in the seconddirection.
 17. The electronic component of claim 15, wherein the firstand second external terminals are disposed on respective ends of theinterposer body opposite each other in the first direction, and eachextend onto both surfaces of the interposer opposite each other in thethird direction.
 18. The electronic component of claim 15, wherein thefirst and second external electrodes and the first and second externalterminals are provided with a conductive adhesive disposed therebetween,respectively.
 19. The electronic component of claim 12, furthercomprising: an interposer having first and second external terminalsdisposed on opposing ends of the interposer body, wherein the interposerhas a first surface that is orthogonal to the first and second internalelectrodes and that is bonded to the body.